Vapor chamber

ABSTRACT

A vapor chamber includes an upper plate and a lower plate. The lower plate is attached on the upper plate. The upper plate and the lower plate are combined together to define a working space. The lower plate is in thermal contact with a heat source. A reinforcing layer is formed on a surface of the upper plate or the lower plate away from the working space.

FIELD OF THE INVENTION

The present invention relates to a heat dissipation device, and moreparticularly to a vapor chamber with a reinforcing layer on an upperplate or a lower plate.

BACKGROUND OF THE INVENTION

A vapor chamber is one of the heat dissipation devices. Generally, thethin vapor chamber is readily suffered from deformation. Especially,during the process of assembling the vapor chamber, the vapor chamber isattached on a heat source. It is important to increase the structuralstrength of the vapor chamber while maintaining the operations of thevapor chamber.

SUMMARY OF THE INVENTION

For solving the drawbacks of the conventional technologies, the presentinvention provides a vapor chamber. The vapor chamber includes an upperplate and a lower plate. A reinforcing layer is formed on the upperplate or the lower plate. Consequently, during the operation of thevapor chamber, the structural strength and the use reliability of thevapor chamber are increased.

In accordance with an embodiment of the present invention, a vaporchamber is provided. The vapor chamber includes an upper plate and alower plate. The lower plate is attached on the upper plate. The upperplate and the lower plate are combined together to define a workingspace. The lower plate is in thermal contact with a heat source. Areinforcing layer is formed on a surface of the upper plate or the lowerplate away from the working space.

In an embodiment, a metallic strength of the reinforcing layer issuperior to a metallic strength of the upper plate or the lower plate,but a thermal conduction property of the reinforcing layer is inferiorto a thermal conduction property of the upper plate or the lower plate.

In an embodiment, the metallic strength is measured according to aVickers hardness, a tensile strength or an elasticity coefficient.

In an embodiment, the thermal conductivity is measured according to athermal conductivity coefficient.

In an embodiment, the reinforcing layer is made of nickel, stainlesssteel or titanium.

In an embodiment, the reinforcing layer has corrosion resistance.

In an embodiment, a first capillary structure is formed on a surface ofthe upper plate facing the working space, and a second capillarystructure is formed on a surface of the lower plate facing the workingspace. At least one support structure is arranged between the firstcapillary structure and the second capillary structure.

In an embodiment, the vapor chamber further includes a heat conductionblock. The heat conduction block is arranged between the lower plate andthe heat source. The heat conduction block is made of pure copper.

In an embodiment, a thermal conduction property of the lower plate issuperior to a thermal conduction property of the upper plate.

In an embodiment, the lower plate includes a raised structure, and theraised structure is in thermal contact with the heat source.

In an embodiment, the reinforcing layer is formed on the surface of thelower plate away from the working space, and the reinforcing layer isarranged between the raised structure and the heat source.

In an embodiment, the reinforcing layer is formed on the surface of thelower plate away from the working space, the reinforcing layer has anopen space corresponding to the raised structure, and the raisedstructure is exposed to the open space.

In an embodiment, the vapor chamber further includes a heat conductionblock. The heat conduction block is arranged between the raisedstructure and the heat source. The heat conduction block is made of purecopper.

In an embodiment, the vapor chamber further includes a fixing frame. Thefixing frame is attached on the lower plate. The fixing frame includes afastening part.

In an embodiment, the heat source is fixed on a supporting plate, andthe fastening part of the fixing frame is fixed on the supporting plate.

In an embodiment, a thermal conduction property of the lower plate issuperior to a thermal conduction property of the upper plate.

In an embodiment, a thermal conduction property of the lower plate issuperior to a thermal conduction property of the fixing frame.

In an embodiment, a metallic strength of the fixing frame is superior toa metallic strength of the lower plate.

In an embodiment, the lower plate is made of pure copper, and the fixingframe is made of copper alloy, stainless steel, plastic steel oraluminum alloy.

In an embodiment, the vapor chamber further includes a heat conductionblock. The heat conduction block is arranged between the fixing frameand the heat source. The heat conduction block is made of pure copper.

In an embodiment, the vapor chamber further includes a fixing frame. Thefixing frame includes a fastening part. The reinforcing layer is formedon the surface of the lower plate away from the working space. Thefixing frame is attached on the reinforcing layer.

In an embodiment, the heat source is fixed on a supporting plate, andthe fastening part of the fixing frame is fixed on the supporting plate.

In an embodiment, a thermal conduction property of the lower plate issuperior to a thermal conduction property of the upper plate.

In an embodiment, a thermal conduction property of the lower plate issuperior to a thermal conduction property of the fixing frame.

In an embodiment, a thermal conduction property of the lower plate issuperior to a thermal conduction property of the reinforcing layer.

In an embodiment, a metallic strength of the fixing frame or thereinforcing layer is superior to a metallic strength of the lower plate.

In an embodiment, the lower plate is made of pure copper, the fixingframe is made of copper alloy, stainless steel, plastic steel oraluminum alloy, and the reinforcing layer is made of nickel, stainlesssteel or titanium.

In an embodiment, the vapor chamber further includes a heat conductionblock. The heat conduction block is arranged between the fixing frameand the heat source. The heat conduction block is made of pure copper

The above objects and advantages of the present invention will becomemore readily apparent to those ordinarily skilled in the art afterreviewing the following detailed description and accompanying drawings,in which:

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a schematic exploded view illustrating a vapor chamberaccording to a first embodiment of the present invention;

FIG. 1B is a schematic cross-sectional view illustrating the vaporchamber according to the first embodiment of the present invention;

FIGS. 1C, 1D and 1E are schematic perspective views illustrating someexamples of the fixing frame of the vapor chamber according to the firstembodiment of the present invention;

FIG. 1F is a schematic cross-sectional view illustrating a variantexample of the vapor chamber according to the first embodiment of thepresent invention, in which the reinforcing layer has an open space;

FIG. 2A is a schematic exploded view illustrating a vapor chamberaccording to a second embodiment of the present invention;

FIG. 2B is a schematic cross-sectional view illustrating the vaporchamber according to the second embodiment of the present invention;

FIG. 2C is a schematic cross-sectional view illustrating a variantexample of the vapor chamber according to the second embodiment of thepresent invention, in which the reinforcing layer has an open space;

FIG. 3A is a schematic exploded view illustrating a vapor chamberaccording to a third embodiment of the present invention;

FIG. 3B is a schematic cross-sectional view illustrating the vaporchamber according to the third embodiment of the present invention;

FIGS. 3C, 3D and 3E are schematic perspective views illustrating someexamples of the fixing frame of the vapor chamber according to the thirdembodiment of the present invention; and

FIG. 3F is a schematic cross-sectional view illustrating a variantexample of the vapor chamber according to the third embodiment of thepresent invention, in which the reinforcing layer has an open space.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Please refer to FIGS. 1A and 1B. FIG. 1A is a schematic exploded viewillustrating a vapor chamber according to a first embodiment of thepresent invention. FIG. 1B is a schematic cross-sectional viewillustrating the vapor chamber according to the first embodiment of thepresent invention.

In this embodiment, the vapor chamber 1 at least comprises an upperplate 11, a lower plate 12 and a fixing frame 13. The lower plate 12 ofthe vapor chamber 1 is in thermal contact with at least one heat source4. The heat source 4 is fixed on a supporting plate 5. After the upperplate 11 and the lower plate 12 of the vapor chamber 1 are attached oneach other or laminated together, a working space 14 is defined. A firstcapillary structure 15 is formed on an inner surface of the upper plate11 (i.e., the surface of the upper plate 11 facing the working space14). A second capillary structure 16 is formed on an inner surface ofthe lower plate 12 (i.e., the surface of the lower plate 12 facing theworking space 14). Moreover, a support structure 17 is arranged betweenthe first capillary structure 15 and the second capillary structure 16.For example, the support structure 17 is a capillary powder post or abraided structure.

The support structure 17 is disposed within the working space 14 toincrease the structural strength of the vapor chamber 1. For reinforcingthe structural strength of the vapor chamber 1, a reinforcing layer 19is formed on an outer surface of at least one of the upper plate 11 andthe lower plate 12 (i.e., the surface of the upper plate 11 or the lowerplate 12 away from the working space 14). As shown in thecross-sectional view of FIG. 1B, the upper layer 11 of the vapor chamber1 is covered by or provided with the reinforcing layer 19, and the lowerplate 12 is covered by or provided with the reinforcing layer 19.Preferably but not exclusively, the reinforcing layer 19 is formed onthe outer surfaces of the upper plate 11 and the lower plate 12, orformed on the surface of the upper plate 11, or formed on the outersurface the lower plate 12 according to the product specifications andrequirements.

In accordance with a feature of the present invention, the metallicstrength of the reinforcing layer 19 is superior to the metallicstrength of the upper plate 11 or the lower plate 12, but the thermalconduction property of the reinforcing layer 19 is inferior to thethermal conduction property of the upper plate 11 or the lower plate 12.The metallic strength is measured according to one of the followingparameters: Vickers hardness, tensile strength and elasticitycoefficient. The thermal conductivity is measured according to thethermal conductivity coefficient. For complying with the above designrules, the upper plate 11 is made of copper alloy, the lower plate 12 ismade of pure copper, and the reinforcing layer 19 is made of nickel,stainless steel or titanium. Moreover, the material of the reinforcinglayer 19 has the corrosion resistance in order to increase thereliability and the use life of the vapor chamber 1.

In the vapor chamber 1 of this embodiment, the thermal conductionproperty of the lower plate 12 is superior to the thermal conductionproperty of the upper plate 11. Since the temperature at the outersurface of the upper plate 11 is not too high, the hand feelingtemperature of the electronic device (e.g., a smart phone or a tabletcomputer) using the vapor chamber 1 is not affected.

In this embodiment, at least one raised structure 121 is formed on aportion of the lower plate 12. The raised structure 121 is in thermalcontact with the at least one heat source 4. In this context, the term“thermal contact” indicates that the raised structure 121 is directlyattached on the heat source 4 or an intermediate medium (a thermalgrease, or another component or a constituent) is arranged between theraised structure 121 and the heat source 4. The arrangement of theraised structure 121 has the following advantages. When the vaporchamber 1 is in thermal contact with the heat source 4, there is aheight difference between the raised structure 121 and the other regionof the lower plate 12. Consequently, the electronic components on thesupporting plate 5 are not pressed or obstructed by the lower plate 12,and the installing flexibility and convenience are enhanced. When thereinforcing layer 19 is formed on the surface of the lower plate 12 awayfrom the working space 14, the reinforcing layer 19 is arranged betweenthe raised structure 121 of the lower plate 12 and the heat source 4.

FIGS. 1C, 1D and 1E are schematic perspective views illustrating someexamples of the fixing frame of the vapor chamber according to the firstembodiment of the present invention. FIG. 1F is a schematiccross-sectional view illustrating a variant example of the vapor chamberaccording to the first embodiment of the present invention, in which thereinforcing layer has an open space.

Please refer to FIG. 1F. In a variant example, the reinforcing layer 19is partially formed on the outer surface of the lower plate 12. That is,the reinforcing layer 19 has an open space 19A. Under this circumstance,the lower plate 12 is not in thermal contact with the heat source 4through the reinforcing layer 19.

For increasing the installation convenience and stability, the vaporchamber 1 is equipped with the fixing frame 13 (see FIG. 1A). The fixingframe 13 is attached on the reinforcing layer 19 on the outer surface ofthe lower plate 12 through a welding means or any other appropriateconnecting means. When the fixing frame 13, the heat source 4 and thesupporting plate 5 are combined together, the raised structure 121provides a pressing force to suppress the heat source 4. Consequently,the heat energy generated by the heat source 4 can be quickly andcompletely transferred to the raised structure 121 through thereinforcing layer 19. Then, the heat energy is dissipated away throughthe vapor chamber 1. In this embodiment, the fixing frame 13 comprises ahollow portion 131 and at least one fastening part 132. Preferably butnot exclusively, the raised structure 121 of the lower plate 12 and aportion of the reinforcing layer 19 are accommodated within the hollowportion 131 of the fixing frame 13, or the raised structure 121 of thelower plate 12 and a portion of the reinforcing layer 19 are extended orprotruded out of the hollow portion 131 of the fixing frame 13.

In an embodiment, the fixing frame 13 is fixed on the supporting plate 5through the at least one fastening part 132. The fastening part 132 ofthe fixing frame 13 is a female threaded rod. The supporting plate 5 hasat least one perforation 51 corresponding to the at least one fasteningpart 132. After a screw 6 is penetrated through the perforation 51 andtightened into the fastening part 132 (e.g., the female threaded rod),the reinforcing layer 19 on the outer surface of the lower plate 12, thefixing frame 13 and the supporting plate 5 (along with the heat source4) are combined together. It is noted that numerous modifications andalterations may be made while retaining the teachings of the invention.For example, in another embodiment, the fastening part 132 of the fixingframe 13 is a male threaded rod and the supporting plate 5 has at leastone perforation 51 corresponding to the at least one fastening part 132.After the male threaded rod is penetrated through the perforation 51, ascrew (not shown) is fixed on the male threaded rod. Consequently, theassembling process is completed. In another embodiment, the fasteningpart 132 of the fixing frame 13 is a threaded hole. After a screw 6 ispenetrated through the perforation 51 of the supporting plate 5 andtightened into the threaded hole, the assembling process is completed.

In an embodiment, the fixing frame 13 is made of copper alloy, stainlesssteel, plastic steel or aluminum alloy. Since the fixing frame 13 hasexcellent metallic strength, the vapor chamber 1 is not readily sufferedfrom deformation during the assembling process. The metallic strength ismeasured according to Vickers hardness, tensile strength or elasticitycoefficient.

In accordance with the designing rules of the vapor chamber 1, themetallic strength of the reinforcing layer 19 is superior to themetallic strength of the upper plate 11 or the lower plate 12, thethermal conduction property of the reinforcing layer 19 is inferior tothe thermal conduction property of the upper plate 11 or the lower plate12, the thermal conduction property of the lower plate 12 is superior tothe thermal conduction property of the upper plate 11, the thermalconduction property of the lower plate 12 is superior to the thermalconduction property of the fixing frame 13, or the metallic strength ofthe fixing frame 13 is superior to the metallic strength of the lowerplate 12. That is, the designing rules may be determined according tothe practical requirements.

Please refer to FIGS. 1A and 1C again. The fixing frame 13 is a hollowframe with a through-hole. That is, the hollow portion 131 is thethrough-hole. Since the raised structure 121 of the lower plate 12 and aportion of the reinforcing layer 19 are accommodated within the hollowportion 131, the overall thickness of the vapor chamber 1 is notincreased.

Hereinafter, some variant examples of the hollow portion 131 of thefixing frame 13 will be described with reference to FIGS. 1D and 1E.

As shown in FIG. 1D, the fixing frame 13 is a hollow frame with a notch133. That is, the hollow portion 131 is defined by the notch 133. Theraised structure 121 of the lower plate 12 and a portion of thereinforcing layer 19 can be accommodated within the hollow portion 131.In other words, the fixing frame 13 is a frame with the notch 133 or aC-shaped frame.

As shown in FIG. 1E, the hollow portion 131 of the fixing frame 13 isdefined by two individual sub-frames 13A and 13B. The raised structure121 of the lower plate 12 and a portion of the reinforcing layer 19 canbe accommodated within the hollow portion 131.

Please refer to FIG. 1F. The reinforcing layer 19 is partially formed onthe outer surface of the lower plate 12, and the raised structure 121 isexposed. The raised structure 121 is disposed within the hollow portionof the fixing frame 13, and the raised structure 121 is in thermalcontact with the heat source 4.

Please refer to FIGS. 2A and 2B. FIG. 2A is a schematic exploded viewillustrating a vapor chamber according to a second embodiment of thepresent invention. FIG. 2B is a schematic cross-sectional viewillustrating the vapor chamber according to the second embodiment of thepresent invention.

In this embodiment, the vapor chamber 2 at least comprises an upperplate 21, a lower plate 22 and a fixing frame 23. the fixing frame 23comprises at least one fastening part 232. The lower plate 22 of thevapor chamber 2 is in thermal contact with at least one heat source 4.The heat source 4 is fixed on a supporting plate 5. After the upperplate 21 and the lower plate 22 of the vapor chamber 2 are attached oneach other or laminated together, a working space 24 is defined. A firstcapillary structure 25 is formed on an inner surface of the upper plate21 (i.e., the surface of the upper plate 21 facing the working space24). A second capillary structure 26 is formed on an inner surface ofthe lower plate 22 (i.e., the surface of the lower plate 22 facing theworking space 24). Moreover, a support structure 27 is arranged betweenthe first capillary structure 25 and the second capillary structure 26.For example, the support structure 27 is a capillary powder post or abraided structure.

The support structure 27 is disposed within the working space 24 toincrease the structural strength of the vapor chamber 2. For reinforcingthe structural strength of the vapor chamber 2, a reinforcing layer 29is formed on an outer surface of at least one of the upper plate 21 andthe lower plate 22 (i.e., the surface of the upper plate 21 or the lowerplate 22 away from the working space 24). As shown in thecross-sectional view of FIG. 2B, the upper layer 21 of the vapor chamber2 is covered by or provided with the reinforcing layer 29, and the lowerplate 22 is covered by or provided with the reinforcing layer 29.Preferably but not exclusively, the reinforcing layer 29 is formed onthe outer surfaces of the upper plate 21 and the lower plate 22, orformed on the surface of the upper plate 21, or formed on the outersurface the lower plate 22 according to the product specifications andrequirements.

In accordance with a feature of the present invention, the metallicstrength of the reinforcing layer 29 is superior to the metallicstrength of the upper plate 21 or the lower plate 22, but the thermalconduction property of the reinforcing layer 29 is inferior to thethermal conduction property of the upper plate 21 or the lower plate 22.The metallic strength is measured according to one of the followingparameters: Vickers hardness, tensile strength and elasticitycoefficient. The thermal conductivity is measured according to thethermal conductivity coefficient. For complying with the above designrules, the upper plate 21 is made of copper alloy, the lower plate 22 ismade of pure copper, and the reinforcing layer 29 is made of nickel,stainless steel or titanium. Moreover, the material of the reinforcinglayer 29 has the corrosion resistance in order to increase thereliability and the use life of the vapor chamber 2.

In the vapor chamber 2 of this embodiment, the thermal conductionproperty of the lower plate 22 is superior to the thermal conductionproperty of the upper plate 21. Since the temperature at the outersurface of the upper plate 21 is not too high, the hand feelingtemperature of the electronic device (e.g., a smart phone or a tabletcomputer) using the vapor chamber 2 is not affected.

For increasing the installation convenience and stability, the vaporchamber 2 is equipped with the fixing frame 23. The fixing frame 23 isattached on the reinforcing layer 29 on the outer surface of the lowerplate 22 through a welding means or any other appropriate connectingmeans. When the fixing frame 23, the heat source 4 and the supportingplate 5 are combined together, a pressing force is provided to suppressthe heat source 4. Consequently, the heat energy generated by the heatsource 4 can be quickly and completely transferred to the lower plate 22through the reinforcing layer 29. Then, the heat energy is dissipatedaway through the vapor chamber 2. In this embodiment, the fixing frame13 comprises the at least one fastening part 232.

In an embodiment, the fixing frame 23 is fixed on the supporting plate 5through the at least one fastening part 232. The fastening part 232 ofthe fixing frame 23 is a female threaded rod. The supporting plate 5 hasat least one perforation 51 corresponding to the at least one fasteningpart 232. After a screw 6 is penetrated through the perforation 51 andtightened into the fastening part 232 (e.g., the female threaded rod),the reinforcing layer 29 on the outer surface of the lower plate 22, thefixing frame 23 and the supporting plate 5 (along with the heat source4) are combined together. It is noted that numerous modifications andalterations may be made while retaining the teachings of the invention.For example, in another embodiment, the fastening part 232 of the fixingframe 23 is a male threaded rod and the supporting plate 5 has at leastone perforation 51 corresponding to the at least one fastening part 232.After the male threaded rod is penetrated through the perforation 51, ascrew (not shown) is fixed on the male threaded rod. Consequently, theassembling process is completed. In another embodiment, the fasteningpart 232 of the fixing frame 23 is a threaded hole. After a screw 6 ispenetrated through the perforation 51 of the supporting plate 5 andtightened into the threaded hole, the assembling process is completed.

In an embodiment, the fixing frame 23 is made of copper alloy, stainlesssteel, plastic steel or aluminum alloy. Since the fixing frame 23 hasexcellent metallic strength, the vapor chamber 2 is not readily sufferedfrom deformation during the assembling process. The metallic strength ismeasured according to Vickers hardness, tensile strength or elasticitycoefficient.

In accordance with the designing rules of the vapor chamber 2, themetallic strength of the reinforcing layer 29 is superior to themetallic strength of the upper plate 21 or the lower plate 22, thethermal conduction property of the reinforcing layer 29 is inferior tothe thermal conduction property of the upper plate 21 or the lower plate22, the thermal conduction property of the lower plate 22 is superior tothe thermal conduction property of the upper plate 21, the thermalconduction property of the lower plate 22 is superior to the thermalconduction property of the fixing frame 23, or the metallic strength ofthe fixing frame 23 is superior to the metallic strength of the lowerplate 22. That is, the designing rules may be determined according tothe practical requirements.

FIG. 2C is a schematic cross-sectional view illustrating a variantexample of the vapor chamber according to the second embodiment of thepresent invention, in which the reinforcing layer has an open space. Ina variant example, the reinforcing layer 29 is partially formed on theouter surface of the lower plate 22. That is, the reinforcing layer 29has an open space 29A. Under this circumstance, the lower plate 22 isnot in thermal contact with the fixing frame 23 or the heat source 4through the reinforcing layer 29. That is, the heat energy generated bythe heat source 4 is transferred to the fixing frame 23, and then theheat energy is transferred to the lower plate 22. Then, the heat energyis dissipated away through the vapor chamber 2.

Please refer to FIGS. 3A and 3B. FIG. 3A is a schematic exploded viewillustrating a vapor chamber according to a third embodiment of thepresent invention. FIG. 3B is a schematic cross-sectional viewillustrating the vapor chamber according to the third embodiment of thepresent invention.

In this embodiment, the vapor chamber 3 at least comprises an upperplate 31, a lower plate 32, a fixing frame 33 and a heat conductionblock 38. The vapor chamber 3 is in thermal contact with at least oneheat source 4. The heat source 4 is fixed on a supporting plate 5. Afterthe upper plate 31 and the lower plate 32 of the vapor chamber 3 areattached on each other or laminated together, a working space 34 isdefined. A first capillary structure 35 is formed on an inner surface ofthe upper plate 31 (i.e., the surface of the upper plate 31 facing theworking space 34). A second capillary structure 36 is formed on an innersurface of the lower plate 32 (i.e., the surface of the lower plate 32facing the working space 34). Moreover, a support structure 37 isarranged between the first capillary structure 35 and the secondcapillary structure 36. For example, the support structure 37 is acapillary powder post or a braided structure.

The support structure 37 is disposed within the working space 34 toincrease the structural strength of the vapor chamber 3. For reinforcingthe structural strength of the vapor chamber 3, a reinforcing layer 39is formed on an outer surface of at least one of the upper plate 31 andthe lower plate 32 (i.e., the surface of the upper plate 31 or the lowerplate 32 away from the working space 34). As shown in thecross-sectional view of FIG. 3B, the upper layer 31 of the vapor chamber3 is covered by or provided with the reinforcing layer 39, and the lowerplate 32 is covered by or provided with the reinforcing layer 39.Preferably but not exclusively, the reinforcing layer 39 is formed onthe outer surfaces of the upper plate 31 and the lower plate 32, orformed on the surface of the upper plate 31, or formed on the outersurface the lower plate 32 according to the product specifications andrequirements.

In accordance with a feature of the present invention, the metallicstrength of the reinforcing layer 39 is superior to the metallicstrength of the upper plate 31 or the lower plate 32, but the thermalconduction property of the reinforcing layer 39 is inferior to thethermal conduction property of the upper plate 31 or the lower plate 32.The metallic strength is measured according to one of the followingparameters: Vickers hardness, tensile strength and elasticitycoefficient. The thermal conductivity is measured according to thethermal conductivity coefficient. For complying with the above designrules, the upper plate 31 is made of copper alloy, the lower plate 32 ismade of pure copper, and the reinforcing layer 39 is made of nickel,stainless steel or titanium. Moreover, the material of the reinforcinglayer 39 has the corrosion resistance in order to increase thereliability and the use life of the vapor chamber 3.

In the vapor chamber 3 of this embodiment, the thermal conductionproperty of the lower plate 32 is superior to the thermal conductionproperty of the upper plate 31. Since the temperature at the outersurface of the upper plate 31 is not too high, the hand feelingtemperature of the electronic device (e.g., a smart phone or a tabletcomputer) using the vapor chamber 3 is not affected.

In this embodiment, a first surface of the heat conduction block 38 isattached on the reinforcing layer 39 on the outer surface of the lowerplate 32 through a welding means or any other appropriate connectingmeans. A second surface of the heat conduction block 38 is in thermalcontact with the at least one heat source 4. In this context, the term“thermal contact” indicates that the heat conduction block 38 isdirectly attached on the heat source 4 or an intermediate medium (athermal grease, or another component or a constituent) is arrangedbetween the heat conduction block 38 and the heat source 4. When theheat conduction block 38, the reinforcing layer 39 and the heat source 4are combined together, the heat energy generated by the heat source 4 istransferred to the reinforcing layer 39 through the heat conductionblock 38. Then, the heat energy is transferred to the lower plate 32.Then, the heat energy is dissipated away through the vapor chamber 3.

For increasing the installation convenience and stability, the vaporchamber 3 is equipped with the fixing frame 33 (see FIG. 3A). The fixingframe 33 is attached on the reinforcing layer 39 on the outer surface ofthe lower plate 32 through a welding means or any other appropriateconnecting means. When the fixing frame 33, the heat source 4 and thesupporting plate 5 are combined together, a pressing force is providedto suppress the heat source 4. Consequently, the heat energy generatedby the heat source 4 can be quickly and completely transferred to thelower plate 32 through the reinforcing layer 39. Then, the heat energyis dissipated away through the vapor chamber 3. In this embodiment, thefixing frame 33 comprises a hollow portion 331 and at least onefastening part 332. The heat conduction block 38 is disposed within thehollow portion 331. That is, the top surface of the heat conductionblock 38 is at the same level with the top surface of the fixing frame33. Consequently, the overall thickness of the vapor chamber 3 is notincreased.

In an embodiment, the fixing frame 33 is fixed on the supporting plate 5through the at least one fastening part 332. The fastening part 332 ofthe fixing frame 33 is a female threaded rod. The supporting plate 5 hasat least one perforation 51 corresponding to the at least one fasteningpart 332. After a screw 6 is penetrated through the perforation 51 andtightened into the fastening part 332 (e.g., the female threaded rod),the reinforcing layer 39 on the outer surface of the lower plate 32, thefixing frame 33 and the supporting plate 5 (along with the heat source4) are combined together. It is noted that numerous modifications andalterations may be made while retaining the teachings of the invention.For example, in another embodiment, the fastening part 332 of the fixingframe 33 is a male threaded rod and the supporting plate 5 has at leastone perforation 51 corresponding to the at least one fastening part 332.After the male threaded rod is penetrated through the perforation 51, ascrew (not shown) is fixed on the male threaded rod. Consequently, theassembling process is completed. In another embodiment, the fasteningpart 332 of the fixing frame 33 is a threaded hole. After a screw 6 ispenetrated through the perforation 51 of the supporting plate 5 andtightened into the threaded hole, the assembling process is completed.

In an embodiment, the upper plate 31 is made of copper alloy, the lowerplate 32 is made of pure copper, and the reinforcing layer 39 is made ofnickel, stainless steel or titanium. The heat conduction block 38 ismade of pure copper. The fixing frame 33 is made of copper alloy,stainless steel, plastic steel or aluminum alloy. Since the thermalconduction property of pure copper is better than the thermal conductionproperty of copper alloy, the heat energy can be transferred from theheat source 4 to the reinforcing layer 39 through the heat conductionblock 38 more efficiently. Since the fixing frame 33 is made of copperalloy, stainless steel, plastic steel or aluminum alloy, the fixingframe 33 has excellent metallic strength. Consequently, the vaporchamber 3 is not readily suffered from deformation during the assemblingprocess. The thermal conductivity is measured according to the thermalconductivity coefficient. The metallic strength is measured according toVickers hardness, tensile strength or elasticity coefficient.

In accordance with the designing rules of the vapor chamber 3, themetallic strength of the reinforcing layer 39 is superior to themetallic strength of the upper plate 31, the lower plate 32 or the heatconduction block 38, the thermal conduction property of the reinforcinglayer 39 is inferior to the thermal conduction property of the upperplate 31, the lower plate 32 or the heat conduction block 38, thethermal conduction property of the lower plate 32 is superior to thethermal conduction property of the upper plate 31, the thermalconduction property of the lower plate 32 is superior to the thermalconduction property of the fixing frame 33, or the metallic strength ofthe fixing frame 33 is superior to the metallic strength of the lowerplate 32. That is, the designing rules may be determined according tothe practical requirement.

FIG. 3C is a schematic perspective view illustrating the fixing frame ofthe vapor chamber according to the third embodiment of the presentinvention. Please refer to FIGS. 3A and 3C. The fixing frame 33 is ahollow frame with a through-hole. That is, the hollow portion 331 is thethrough-hole. Since the heat conduction block 38 is accommodated withinthe hollow portion 331, the overall thickness of the vapor chamber 3 isnot increased.

It is noted that the examples of the hollow portion 331 are notrestricted. Hereinafter, some variant examples of the hollow portion 331of the fixing frame 33 will be described with reference to FIGS. 3D and3E.

As shown in FIG. 3D, the fixing frame 33 is a hollow frame with a notch333. That is, the hollow portion 331 is defined by the notch 333. Theheat conduction block 38 can be accommodated within the hollow portion331. In other words, the fixing frame 33 is a frame with the notch 333or a C-shaped frame.

As shown in FIG. 3E, the hollow portion 331 of the fixing frame 33 isdefined by two individual sub-frames 33A and 33B. The heat conductionblock 38 can be accommodated within the hollow portion 331.

FIG. 3F is a schematic cross-sectional view illustrating a variantexample of the vapor chamber according to the third embodiment of thepresent invention. In this embodiment, the reinforcing layer 39 ispartially formed on the outer surface of the lower plate 32. That is,the reinforcing layer 39 has an open space 39A. The heat conductionblock 38 is accommodated within the open space 39A. Unlike theembodiment of FIG. 3B, the lower plate 32 is not in thermal contact withthe heat source 4 through the reinforcing layer 39. In this embodiment,the lower plate 32 is in thermal contact with the heat source 4 throughthe heat conduction block 38. Unlike the embodiment of FIG. 3B, thefixing frame 33 is not attached on the reinforcing layer 39. In thisembodiment, the fixing frame 33 is attached on the lower plate 32through the open space 39A.

While the invention has been described in terms of what is presentlyconsidered to be the most practical and preferred embodiments, it is tobe understood that the invention needs not be limited to the disclosedembodiments. On the contrary, it is intended to cover variousmodifications and similar arrangements included within the spirit andscope of the appended claims which are to be accorded with the broadestinterpretation so as to encompass all modifications and similarstructures.

What is claimed is:
 1. A vapor chamber, comprising: an upper plate; anda lower plate attached on the upper plate, wherein the upper plate andthe lower plate are combined together to define a working space, and thelower plate is in thermal contact with a heat source, wherein areinforcing layer is formed on a surface of the upper plate or the lowerplate away from the working space.
 2. The vapor chamber according toclaim 1, wherein a metallic strength of the reinforcing layer issuperior to a metallic strength of the upper plate or the lower plate,but a thermal conduction property of the reinforcing layer is inferiorto a thermal conduction property of the upper plate or the lower plate.3. The vapor chamber according to claim 2, wherein the metallic strengthis measured according to a Vickers hardness, a tensile strength or anelasticity coefficient.
 4. The vapor chamber according to claim 2,wherein the thermal conductivity is measured according to a thermalconductivity coefficient.
 5. The vapor chamber according to claim 1,wherein the reinforcing layer is made of nickel, stainless steel ortitanium.
 6. The vapor chamber according to claim 1, wherein thereinforcing layer has corrosion resistance.
 7. The vapor chamberaccording to claim 1, wherein a first capillary structure is formed on asurface of the upper plate facing the working space, and a secondcapillary structure is formed on a surface of the lower plate facing theworking space, wherein at least one support structure is arrangedbetween the first capillary structure and the second capillarystructure.
 8. The vapor chamber according to claim 1, further comprisinga heat conduction block, wherein the heat conduction block is arrangedbetween the lower plate and the heat source, and the heat conductionblock is made of pure copper.
 9. The vapor chamber according to claim 1,wherein a thermal conduction property of the lower plate is superior toa thermal conduction property of the upper plate.
 10. The vapor chamberaccording to claim 1, wherein the lower plate comprises a raisedstructure, and the raised structure is in thermal contact with the heatsource.
 11. The vapor chamber according to claim 10, wherein thereinforcing layer is formed on the surface of the lower plate away fromthe working space, and the reinforcing layer is arranged between theraised structure and the heat source.
 12. The vapor chamber according toclaim 10, wherein the reinforcing layer is formed on the surface of thelower plate away from the working space, the reinforcing layer has anopen space corresponding to the raised structure, and the raisedstructure is exposed to the open space.
 13. The vapor chamber accordingto claim 10, further comprising a heat conduction block, wherein theheat conduction block is arranged between the raised structure and theheat source, and the heat conduction block is made of pure copper. 14.The vapor chamber according to claim 1, further comprising a fixingframe, wherein the fixing frame is attached on the lower plate, and thefixing frame comprises a fastening part.
 15. The vapor chamber accordingto claim 14, wherein the heat source is fixed on a supporting plate, andthe fastening part of the fixing frame is fixed on the supporting plate.16. The vapor chamber according to claim 14, wherein a thermalconduction property of the lower plate is superior to a thermalconduction property of the upper plate.
 17. The vapor chamber accordingto claim 14, wherein a thermal conduction property of the lower plate issuperior to a thermal conduction property of the fixing frame.
 18. Thevapor chamber according to claim 14, wherein a metallic strength of thefixing frame is superior to a metallic strength of the lower plate. 19.The vapor chamber according to claim 14, wherein the lower plate is madeof pure copper, and the fixing frame is made of copper alloy, stainlesssteel, plastic steel or aluminum alloy.
 20. The vapor chamber accordingto claim 14, further comprising a heat conduction block, wherein theheat conduction block is arranged between the fixing frame and the heatsource, and the heat conduction block is made of pure copper.
 21. Thevapor chamber according to claim 1, further comprising a fixing frame,wherein the fixing frame comprises a fastening part, the reinforcinglayer is formed on the surface of the lower plate away from the workingspace, and the fixing frame is attached on the reinforcing layer. 22.The vapor chamber according to claim 21, wherein the heat source isfixed on a supporting plate, and the fastening part of the fixing frameis fixed on the supporting plate.
 23. The vapor chamber according toclaim 21, wherein a thermal conduction property of the lower plate issuperior to a thermal conduction property of the upper plate.
 24. Thevapor chamber according to claim 21, wherein a thermal conductionproperty of the lower plate is superior to a thermal conduction propertyof the fixing frame.
 25. The vapor chamber according to claim 21,wherein a thermal conduction property of the lower plate is superior toa thermal conduction property of the reinforcing layer.
 26. The vaporchamber according to claim 21, wherein a metallic strength of the fixingframe or the reinforcing layer is superior to a metallic strength of thelower plate.
 27. The vapor chamber according to claim 21, wherein thelower plate is made of pure copper, the fixing frame is made of copperalloy, stainless steel, plastic steel or aluminum alloy, and thereinforcing layer is made of nickel, stainless steel or titanium. 28.The vapor chamber according to claim 21, further comprising a heatconduction block, wherein the heat conduction block is arranged betweenthe fixing frame and the heat source, and the heat conduction block ismade of pure copper.